Netzer DS-40 offer accuracy unrivaled by competing sensors. Lightweight, low profile and excellent resistance to RFI and magnetic fields further differentiate them
• 40mm diameter
• SSI, BiSS-C
• Up to 20 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DS-58 offer accuracy unrivaled by competing sensors. Lightweight, low profile and excellent resistance to RFI and magnetic fields further differentiate them
• 58mm diameter
• SSI, BiSS-C, Analog (sin/cos)
• Up to 20 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DS-70 offer users a large though-hole flexibility with up to 4 mdeg of accuracy
• 70 mm diameter
• SSI, BiSS-C
• Up to 21 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DS-90 offer users a large though-hole flexibility with up to 4 mdeg of accuracy
• 90mm diameter
• SSI, BiSS-C
• Up to 21 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DS-130 offer users a large though-hole flexibility with up to 4 mdeg of accuracy
• 130 mm diameter
• SSI, BiSS-C
• Up to 21 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DF-60 encoders are a compact, novel 2 plate encoder solution
• 60mm diameter
• SSI, BiSS-C
• 18 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Netzer DF-100 encoders are a novel 2 plate encoder solution offering a large through-bore
• 100mm diameter
• SSI, BiSS-C
• 18 bit resolution
• High tolerance to EMI, RFI and magnetic fields
37 and 58mm non-contact, inductive Zettlex (Celera Motion) encoders for high-precision, reliable measurement in harsh environments
• Compact size (37, 58mm options)
• Interfaces: SSI, SPI, BiSS-C, Incremental
• Up to 17 bit resolution
• Ultra high shock and vibration options
Netzer DF – 150 encoders are a large scale novel 2 plate encoder solution
• 150mm diameter
• SSI, BiSS-C
• 18 bit resolution
• High tolerance to EMI, RFI and magnetic fields
Non-contact, inductive Zettlex (Celera Motion) encoders for high-precision, reliable measurement in harsh environments.
• Wide varitey of through-hollow sizes
• Interfaces: SSI, SPI, BiSS-C, Incremental, Analog
• Up to 22 bit resolution
• Ultra high shock and vibration options